Chiplet & Advanced-Packaging Reference Matrix
A one-page comparison of the major 2.5D and 3D packaging approaches (CoWoS, Foveros, EMIB, SoIC, fan-out, hybrid bonding, photonic) by interconnect pitch, bandwidth, thermal headroom, and best fit. Preview free; unlock the full matrix.
Chiplet & Advanced-Packaging Reference Matrix
| Technology | Type | Interconnect / Pitch | Rel. Bandwidth | Thermal Headroom | Best Fit |
|---|---|---|---|---|---|
| TSMC CoWoS | 2.5D Si interposer | Microbump ~40µm | High | Moderate | HBM + logic AI accelerators |
| Intel Foveros | 3D die stacking | Hybrid bond ~36→9µm | Very high | Low (stacked heat) | Logic-on-logic, mobile SoCs |
| Intel EMIB | Embedded bridge (2.5D) | Microbump ~55µm | High | Moderate | Cost-sensitive high-BW links |
| TSMC SoIC | 3D hybrid bonding | Bondless <10µm | Very high | Low | Cache-on-core integration |
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