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chiplet

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interposer bridge die advanced packaging

How Passive Interposers Become Active: The Case for Embedded Bridge Dies

Embedded bridge dies are turning passive silicon interposers into active routing layers, here's what that means for chiplet bandwidth and cost.

P. Nakamura

· May 7, 2026 · 4 min read

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advanced packaging heterogeneous integration chiplets chiplet design UCIe 3D stacking chiplet integration chiplet interconnect chiplet yield CoWoS die-to-die interconnect hybrid bonding

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