Why Chiplet IP Licensing Is Becoming a Packaging Decision, Not Just a Legal One
Chiplet IP licensing terms now hinge on bump pitch, bonding type, and package integration, forcing legal and packaging teams to negotiate together.
P. Nakamura Topic
UCIe
5 posts tagged UCIe from Chiplet Ecosystem.
P. Nakamura More on UCIe
How Chiplet Interconnect Protocol Overhead Eats Die Area Before Logic Synthesis Starts
Protocol overhead in chiplet interconnects consumes meaningful die area before logic synthesis begins, and most teams discover this far too late in the design flow.
P. NakamuraWhy Chiplet Security Boundaries Are Harder to Draw Than Chip Boundaries
Disaggregating SoCs into chiplets doesn't just split silicon, it splits trust. Here's why securing die-to-die interfaces is genuinely unsolved.
P. NakamuraHow Die-to-Die Interconnect Latency Is Reshaping Chiplet Disaggregation Decisions
Die-to-die latency isn't just a spec footnote, it's quietly determining which functions can be disaggregated into chiplets and which cannot.
P. NakamuraUCIe Is the Boring Standard That Changes Everything
The Universal Chiplet Interconnect Express standard could do for chiplets what PCIe did for expansion cards. Here is what matters.
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