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samsung

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vertical-integration samsung tsmc

Samsung's I-Cube4 vs. TSMC SoIC: The Battle for Vertical Integration

Samsung's I-Cube4 and TSMC's SoIC represent two distinct approaches to vertical chiplet stacking and 3D integration.

P. Nakamura

· April 2, 2026 · 3 min read

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advanced packaging heterogeneous integration chiplets chiplet design UCIe 3D stacking chiplet integration chiplet interconnect chiplet yield CoWoS die-to-die interconnect hybrid bonding

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