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Intel

1 post tagged Intel from Chiplet Ecosystem.

TSMC Intel advanced-packaging

TSMC CoWoS vs. Intel Foveros: Two Bets on the Same Future

TSMC and Intel are taking different packaging approaches to the same chiplet future. Both strategies have real tradeoffs.

P. Nakamura

· February 28, 2025 · 2 min read

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advanced packaging heterogeneous integration chiplets chiplet design UCIe 3D stacking chiplet integration chiplet interconnect chiplet yield CoWoS die-to-die interconnect hybrid bonding

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