Topic

RDL

1 post tagged RDL from Chiplet Ecosystem.

advanced packaging fanout RDL

Why RDL Fanout Pitch Determines Chiplet Integration Density Before Anything Else

Redistribution layer fanout pitch quietly caps chiplet integration density before interconnect standards or die size ever become the limiting factor.

P. Nakamura

· June 1, 2026 · 4 min read

Browse more topics

advanced packaging heterogeneous integration chiplets chiplet design UCIe 3D stacking chiplet integration chiplet interconnect chiplet yield CoWoS die-to-die interconnect hybrid bonding

← All posts from Chiplet Ecosystem